Advanced Semiconductor Packaging Devices

Device performance and functionality are accelerating advanced packaging developments. However, as heterogeneous integration and sophisticated packaging push performance boundaries, the innovative architectures are posing new defect analysis and process characterization challenges. With increasing packaging density, shrinking interconnect dimensions, pitches, and novel materials, defectivity is on the rise. Packaging defects seriously affect the reliability and performance of the final product, potentially leading to failures in the field and massive loss of yield at the very end of the manufacturing line.